http://uet.vnu.edu.vn/~trinhcd/Image/Coltech_logo.jpg

VIETNAM NATIONAL UNIVERSITY, HANOI (vnuH)

University OF Engineering and TECHNOLOGY (uET)

 

Faculty of Electronics and Telecommunications

Department of MEMS and Microsystems

 

 

Addr: G2 building, 144 Xuan Thuy, Cau Giay, Hanoi

VIETNAM

Tel: +84 4 754 9338

Fax: + 84 4 7547460

 

 

 

Education

Publications

Honor and Awards

 

 

 

BÙI THANH TÙNG, D.Eng.

IMG_0597

Email: tungbt@vnu.edu.vn

tungbt@gmail.com

 

 

 

EDUCATION

  •  Sep. 2008 to Sep. 2011

Doctoral Candidate in MEMS

Institution

Ritsumeikan University, Japan

  •    Sep. 2006 to Aug. 2008

M.Sc. in MEMS

Institution

Ritsumeikan University, Japan

  •    Sep. 1999 – May 2004

B. Eng. in Electronics and Telecommunications

Institution

College of Technology, Vietnam National University - Hanoi, Vietnam

 


PUBLICATIONS and PATENTS

 

 

Journal papers (refereed)

 

[1]     B. T. Tung, M. Suzuki, F. Kato, S. Nemoto, N. Watanabe and M. Aoyagi, "Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration", Japanese Journal of Applied Physics, 2013, Accepted.
ISSN  Online: 1347-4065 / Print: 0021-4922

[2]     V. T. Dau, B. T. Tung, D. V. Dao, and S. Sugiyama, “Integration of CNTs Thin Film for Sensing and Actuating Micro Structures," Vietnam Journal of Mechanics, vol. 34, no. 4, pp. 299–309, Nov. 2012.
ISSN  0866 7136

[3]     B. T. Tung, M. Suzuki, F. Kato, S. Nemoto, and M. Aoyagi, “Heterogeneous Integration Approach based on Flop-chip Bonding and Misalignment Selft-corection Elements for Electronics-Optics Integration Applications,” Vietnam Journal of Mechanics, vol. 34, no. 4, pp. 289–297, Nov. 2012.
ISSN  0866 7136

[4]     B. T. Tung, H. M. Nguyen, D. V. Dao, S. Rogge, H. W. M. Salemink, and S. Susumu, “Strain Sensitive Effect in a  Triangular Lattice Photonic Crystal Hole-modified Nanocavity,” IEEE Sensors Journal, vol. 11, no. 11, pp. 2657-2663, Nov. 2011.
http://dx.doi.org/10.1109/JSEN.2011.2157122  ISSN 1530-437X

[5]     B. T. Tung, D.V.Dao, and S. Sugiyama, "Nanostrain Sensing Based on Piezo-optic Property of a Photonic Crystal Cavity", IEEJ Transactions on Sensors and Micromachines,  Vol. 131 / No. 7 / Sec. E., pp.258-263, Jul. 2011.
http://dx.doi.org/10.1541/ieejsmas.131.258  ISSN 1347-5525

[6]     B. T. Tung, D.V. Dao, T. Ikeda, Y. Kanamori, K. Hane, and S. Sugiyama, “Investigation of strain sensing effect in modified single-defect photonic crystal nanocavity,” Optic Express, Vol. 19, no. 9, pp. 8821-8829, Apr. 2011.
http://dx.doi.org/10.1364/OE.19.008821  ISSN 1094-4087

[7]     D.V. Dao, B. T. Tung, K. Nakamura, V.T. Dau, T. Yamada, K. Hata, and S. Sugiyama, “Towards highly sensitive strain sensing based on nanostructured materials,” Advances in Natural Sciences: Nanoscience and Nanotechnology,  vol. 1, Jan.  2011, p. 045012.
http://dx.doi.org/10.1088/2043-6262/1/4/045012  ISSN 2043-6262

[8]     D.V. Dao, K. Nakamura, B. T. Tung, and S. Sugiyama, “Micro/nano-mechanical sensors and actuators based on SOI-MEMS technology,” Advances in Natural Sciences: Nanoscience and Nanotechnology,  vol. 1, Mar. 2010, p. 013001.
http://dx.doi.org/10.1088/2043-6254/1/1/013001  ISSN 2043-6262

[9]     V.T. Dau, T. Yamada, D. V. Dao, B. T. Tung, K. Hata, and S. Sugiyama, “Integrated CNTs thin film for MEMS mechanical sensors,” Microelectronics Journal,  vol. 41, Dec. 2010, pp. 860-864.
http://dx.doi.org/10.1016/j.mejo.2010.07.012  ISSN 0026-2692

[10] V.T. Dau, D.V. Dao, T. Yamada, B. T. Tung, K. Hata, and S. Sugiyama, “Integration of SWNT film into MEMS for a micro-thermoelectric device,” Smart Materials and Structures,  vol. 19, Jul. 2010, p. 075003.
http://dx.doi.org/10.1088/0964-1726/19/7/075003  ISSN 0964-1726

[11] B. T. Tung, D.V. Dao, T. Toriyama, and S. Sugiyama, “Measurement of mechanical and thermal properties of co-sputtered WSi thin film for MEMS applications,” Microsystem Technologies,  vol. 16, Jun. 2010, pp. 1881-1886.
http://dx.doi.org/10.1007/s00542-010-1109-6  ISSN 0946-7076

[12] T.D. Tan, N.T. Long, N.P. Thuy, D.V. Dung, and B. T. Tung, “Full analysis and fabrication of a piezoresistive three degree of freedom accelerometor,” Advances in Natural Sciences,  vol. 10, Jun. 2009, pp. 187-192.

[13] B. T. Tung, D.V. Dung, D.T. Van, and S. Susumu, “Three degree of freedom micro accelerometer depends on MEMS technology: Fabrication and application,” Advances in Natural Sciences,  vol. 10, Jun. 2009, pp. 229-236.

[14] V. N. Hung, N. V. Minh, L. V. Minh, N. H. Hung, D. V. Dao, C. M. Hoang, R. Amarasinghe, B. T. Tung, and S. Sugiyama, “Design and Fabrication of a Miniaturized Three-Degree-of-Freedom Piezoresistive Acceleration Sensor Based on MEMS Technology Using Deep Reactive Ion Etching,” in Physics and Engineering of New Materials, vol. 127, D. T. Cat, A. Pucci, and K. Wandelt, Eds. Springer Berlin Heidelberg, 2009, pp. 377–383.
http://dx.doi.org/10.1007/978-3-540-88201-5_44  ISBN 978-3-540-88200-8 (book chapter)

[15] B. T. Tung, D.V. Dao, A. Ranjith, W. Naoki, T. Hiroshi, and S. Susumu, “Development of a 3-DOF Micro Accelerometer with Wireless Readout,” IEEJ Transactions on Sensors and Micromachines,  vol. 128, May. 2008, pp. 235-239.
http://dx.doi.org/10.1541/ieejsmas.128.235  ISSN 1530-437X

 

 

Conference papers 

International Conference

[16] B. T. Tung, M. Suzuki, F. Kato, N. Watanabe, S. Nemoto, and M. Aoyagi, Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications, Electronic Components and Technology Conference (ECTC), Las Vegas, USA (accepted).

[17] B. T. Tung, M. Suzuki, F. Kato, N. Watanabe, S. Nemoto, and M. Aoyagi, "Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration" The 2nd International Symposium on Photonics and Electronics Convergence (ISPEC2012), Tokyo, Japan, 2012.
Tokyo, Japan on 3-5 December, 2012

[18] B. T. Tung, L. Ma, M. Suzuki, F. Kato, S. Nemoto, N. Watanabe, and A. Masahiro, “Sub-micron-accuracy Gold to Gold Interconnection Flip-Chip Bonding Approach for Electronics-Optics Heterogeneous Integration,” in Int. Conf. Solid State Devices and Materials, 2012, Kyoto, Japan, p. 1174.

[19] B. T. Tung, L. Ma, M. Suzuki, F. Kato, N. Shunsuke, and A. Masahiro, “High-precision heterogeneous integration based on flip-chip bonding using misalignment self-correction elements,” in Int. Conf. Opt. MEMS and Nanophoton., Canada, 2012, p. 93.
http://dx.doi.org/10.1109/OMEMS.2012.6318818

[20] D. V. Dao, B. T. Tung, S. Sugiyama, “Strain Sensing Effect in Silicon Photonic Crystal Nanocavities”, in Proceedings of the 3rd Int'l Workshop on Nanotechnology and Application, Nov.10-12, 2011, Vung Tau, Vietnam, pp. 167-171.

[21] B. T. Tung, D. V. Dao, T. Ikeda, Y. Kanamori, K. Hane, and S. Sugiyama, “Longitudinal strain sensitive effect in a photonic crystal cavity,” in Procedia Engineering, vol. 25, 2011, Elsevier (EUROSENSORS XXV), Athens, Greece 4-7 Sep. 2011, pp. 1357-1360.
http://dx.doi.org/10.1016/j.proeng.2011.12.335

[22] D. V. Dao, K. Shibuya, B. T. Tung, and S. Sugiyama, “Micromachined NH3 Gas Sensor with ppb-level Sensitivity Based on WO3 Nanoparticles Thinfilm,” in Procedia Engineering, vol. 25,  2011, Elsevier (EUROSENSORS XXV), Athens, Greece 4-7 Sep. 2011, pp. 1149–1152.
http://dx.doi.org/10.1016/j.proeng.2011.12.283

[23] B. T. Tung, V. T. Dau, D. V. Dao, T. Yamada, K. Hata, and S. Sugiyama, “Fabrication and characterization of silicon micro mirror with CNT hinge,” in Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, Cancun, Mexico, Jan. 2011, pp. 688 –691.
http://dx.doi.org/10.1109/MEMSYS.2011.5734518

[24] B. T. Tung, H.M. Nguyen, D.V. Dao, S. Rogge, H. Salemink, and S. Susumu, “Strain Sensitivity of a Modified Single-Defect Photonic Crystal Nanocavity for Mechanical Sensing,” in Sensors, 2010 IEEE,  Hawaii, USA, Nov. 2010, pp. 2585-2588.
http://dx.doi.org/10.1109/ICSENS.2010.5690169

[25] Tan Duc Tran, Tuyen Ta Duc, and B. T. Tung, “Combination compress sensing and digital wireless transmission for the MRI signal,” in Micro-NanoMechatronics and Human Science (MHS), Nov. 2010 International Symposium on, Nagoya, Japan, Nov. 2010, pp. 273-276.
http://dx.doi.org/10.1109/MHS.2010.5669546

[26] Dzung Viet Dao, B. T. Tung, and S. Sugiyama, “Theoretical investigation of piezo-optic effect in photonic crystal nanocavity for nanostrain detection,” in Micro-NanoMechatronics and Human Science (MHS), 2010 International Symposium on, Nagoya, Japan, Nov. 2010, pp. 443-446.
http://dx.doi.org/10.1109/MHS.2010.5669506

[27] B. T. Tung, Dzung Viet Dao, and S. Sugiyama, “Investigation of strain sensitivity of photonic crystal nanocavity for mechanical sensing,” in Optical MEMS and Nanophotonics (OPT MEMS), 2010 International Conference on,  Sapporo, Japan, Oct. 2010, pp. 183-184.
http://dx.doi.org/10.1109/OMEMS.2010.5672122

[28] B. T. Tung, Dzung Viet Dao, K. Nakamura, T. Toriyama, and S. Sugiyama, “Characterization of the piezoresistive effect and temperature coefficient of resistance in single crystalline silicon nanowires,” in Micro-NanoMechatronics and Human Science, 2009. MHS  2009. International Symposium on, Nagoya, Japan, Nov. 2009, pp. 462-466.
http://dx.doi.org/10.1109/MHS.2009.5352099

[29] T. Tran, B. T. Tung, and T. Nguyen, “A novel optimization procedure for designing of high-sensitivity piezoresistive accelerometers utilizing MNA method,” in Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on, Nagoya, Japan , Nov. 2009, pp. 44-47.
http://dx.doi.org/10.1109/MHS.2009.5351972

[30] K. Nakamura, Dzung Viet Dao, B. T. Tung, T. Toriyama, and S. Sugiyama, “Piezoresistive effect in silicon nanowires — A comprehensive analysis based on first-principles calculations,” in Micro-NanoMechatronics and Human Science, 2009. MHS 2009. International Symposium on, Nagoya, Japan, Nov. 2009, pp. 38-43.
http://dx.doi.org/10.1109/MHS.2009.5352099

[31] Van Thanh Dau, T. Yamada, Dzung Viet Dao, B. T. Tung, K. Hata, and S. Sugiyama, “Piezoresistive and thermoelectric effects of CNT thin film patterned by EB lithography,” in Sensors, 2009 IEEE, Christchurch, New Zealand, Oct. 2009, pp. 1048-1051.
http://dx.doi.org/10.1109/ICSENS.2009.5398590

[32] B. T. Tung, Dzung Viet Dao, T. Toriyama, and S. Sugiyama, “Evaluation of the piezoresistive effect in single crystalline silicon nanowires,” in Sensors, 2009 IEEE, Christchurch, New Zealand, Oct. 2009, pp. 41-44.
http://dx.doi.org/10.1109/ICSENS.2009.5398124

[33] R. Amarasinghe, D. Dao, V. Dau, B. T. Tung, and S. Sugiyama, “Sensitivity enhancement of piezoresistive micro acceleration sensors with Nanometer Stress Concentration Regions on sensing elements,” in Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International, Jun. Colorado, USA, Jun. 2009, pp. 1333-1336.
http://dx.doi.org/10.1109/SENSOR.2009.5285847

[34] Thanh Van Dau, Thien Xuan Dinh, Dzung Viet Dao, A. Ranjith, B. T. Tung, and S. Susumu, “Design and Simulation of Convective Inertial Sensor,” in Micro-NanoMechatronics and Human Science, 2008. MHS 2008. International Symposium on, Nagoya, Japan , Nov. 2008, pp. 33-36.
http://dx.doi.org/10.1109/MHS.2008.4752418

[35] P. H. Pham, D. V. Dao, B. T. Tung, and S. Sugiyama, “A Micro Rotational Motor Based on Ratchet Mechanism and Electrostatic Comb-Drive Actuators,” in The 4th Asia Pacific Conference on Transducers andMicro-Nano Technology (APCOT’8), Taiwan, 2008, pp. 55–58.

[36] T. Tran, D. Dao, B. T. Tung, L. Nguyen, T. Nguyen, and S. Susumu, “Optimum design considerations for a 3-DOF micro accelerometer using nanoscale piezoresistors,” in Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on, Sanya, China, Jan. 2008, pp. 770-773.
http://dx.doi.org/10.1109/NEMS.2008.4484440

[37] B. T. Tung, D. V. Dao, Dau Thanh Van, and Sugiyama Susumu, “Three degree of freedom micro accelerometer depend on MEMS technology: Fabrication and application,” in the First International Workshop On Nanotechnology And Application IWNA 2007, Vung Tau, Vietnam, 2007, pp. 89–92.

[38] T. D. Tan, D. V. Dung, B. T. Tung, N. T. Long, N. P. Thuy, Full Analysis and Fabrication of a Piezoresistive Three Degree of Freedom Accelerometer, in the First International Workshop On Nanotechnology And Application IWNA 2007 Vietnam National University, 2007, pp. 264-267. 

[39] C. D. Trinh, N. T. Long, B. T. Tung, and N. P. Thuy, “Patient monitoring system based on MEMS sensors and wireless network,” in International Conference on Mechatronics Technology (ICMT2005), Malaysia, 2005.

[40] Chu Duc Trinh, Nguyen Phu Thuy, Dinh Van Dung, and B. T. Tung, “Application of MEMS pressure sensors in the medical electronic device,” in the Seventh Vietnamese – German Seminar on Physics and Engineering, Halong, Vietnam, 2004, pp. 230–233.


Domestic Conference

[41] Dzung Viet Dao, B. T. Tung, Susumu Sugiyama, "Displacement Sensing Based on Two-dimensional Photonic Crystal Nano-rod Defect Cavity", in Technical Digest of the 28th Sensor Symposium, (IEEJ), 26-27 Sep 2011, Tokyo, Japan, pp. 474-477.

[42] B. T. Tung, Dzung Viet Dao, and Susumu Sugiyama, “Nanostrain sensing based on piezo-optic property of a photonic crystal filter sensor symposyum,” in The 27th Sensor Symposium on Sensors, Micromachines and Applied Systems, Matsue, Japan, 2010, pp. 334-337.

[43] B. T. Tung, Dzung Viet Dao, Susumu Sugiyama, “Nanostrain Sensing Based on Piezo-optic Property of a Photonic Crystal Filter”, in The 27th Sensor Symposium, (IEEJ), 14-15 October 2010, Matsue, Japan, pp.334-337

[44] B. T. Tung, D. V. Dao, and S. Sugiyama, “Properties of Sputtered Tungsten Silicide Thinfilm Measured by Using MEMS Structures,” in 20th MicroElectronic Symposium, Shiga, Japan, 2010, pp. 267-270.

[45] B. T. Tung et al., “Evaluation of Properties of Sputtered Tungsten Silicide Thinfilm for MEMS Applications,” in The 26th Sensor Symposium on Sensors, Micromachine and Applied Systems, Tokyo, Japan, 2009, pp. 182-186.

[46] B. T. Tung, Dzung Viet Dao, Ranjith Amarashinge, Naoki Wada, Hiroshi Tokunaga, and Susumu Sugiyama, “Development of a Three Degree of Freedom Micro Accelerometer Using MEMS Technology for Wireless Accelerometers Network,” in The 24th Sensor Symposium on Sensors, Micromachine and Applied Systems, Tokyo, Japan, 2007, pp. 259-262.

[47] Van Thanh Dau, Thien Xuan Dinh, Dzung Viet Dao, B. T. Tung, and Susumu Sugiyama, “Design and Simulation of a Novel 3-DOF MEMS Convective Gyroscope,” in The 24th Sensor Symposium on Sensors, Micromachine and Applied Systems, Tokyo, Japan, 2007, pp. 387-390.

[48] B. T. Tung, D.V.Dzung, D.T.Van, S.Sugiyama, "Development of a Three Degree of Freedom Micro Accelerometer Using MEMS Technology", in The 8th National Congress on Mechatronics, Hanoi, Vietnam, December 6-9, 2007

[49] Chu Duc Trinh, Nguyen Phu Thuy, Vu Ngoc Hung, Dinh Van Dung, B. T. Tung, Tran Duc Tan, and Vu Viet Hung, “Applications of MEMS pressure sensors in the medicine electronic devices,” in Hội nghị Điện tử toàn quốc lần thứ 2, Ho Chi Minh, Viet Nam, May. 2004.

 

 

Patents

 

[50] Patient monitoring systems (Hệ thống giám sát bệnh nhân từ xa), in Vietnamese, Vietnam application No.: 2-2011-00176, publication No.: 2-0001018.

[51] Method of manufacturing semiconductor devices (半導体装置の製造方法), in Japanese, Japan patent application No. 2012-210008. Filing date: 2012 September 24, 2012.

 


Honors and awards

   2009, 2010 

Honors Scholarship of Society for the Advancement of Science and Technology at Ritsumeikan (ASTER).

   2007

Co-receiver, “For the Community Benefit Award” - The Vietnamese Genius Contest 2007 for the Patient essential parameters monitoring system (giải thưởng lợi ích cộng đồng”, cuộc thi "Nhân tài đất Việt",  2007) cho hệ thống thu thập các thông số bản của bệnh nhân.

   2006

Scholarship of Vietnam Ministry of Education and Training for study aboard.

   2004

1st prize - Scientific Research Contest for Students, Vietnam Ministry of Education and Training.